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MAX1490EAEPG+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX1490EAEPG+ - RS422/RS485 Transceiver Isolated, 1 Driver, 4.5V to 5.5V Supply, DIP-24

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MAX1490EAEPG+ - Analog Devices - PCB symbol
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PCB Footprints
MAX1490EAEPG+ - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P24+4
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3D Models
MAX1490EAEPG+ - Analog Devices - 3D model - Dual-In-Line Packages - P24+4
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MAX1490EAEPG+ Details

  • Manufacturer Part Number:

    MAX1490EAEPG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    24-PDIP-600_MIL

  • Package Description:

    PLASTIC, DIP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-PDIP-600_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2001-10-31

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDIP-T24

  • JESD-609 Code:

    e3

  • Length:

    31.75 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP24,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    225 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    180 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    275 ns

  • Width:

    15.24 mm

MAX1490EAEPG+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX1490EAEPG+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to minimize the length of the traces connecting the device to the power supply and other components.
  • The MAX1490EAEPG+ requires a single 3.3V or 5V power supply, and it's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirements are not critical, but it's recommended to power up the device after the power supply has stabilized. Additionally, it's recommended to add decoupling capacitors close to the device to filter out noise and ensure stable operation.
  • The MAX1490EAEPG+ can achieve data rates of up to 100Mbps, but the actual data rate may vary depending on the specific application, cable length, and noise environment. It's recommended to consult the datasheet and application notes for more information on data rate and signal integrity.
  • To troubleshoot common issues with the MAX1490EAEPG+, start by checking the power supply and ensuring it's stable and within the recommended range. Next, verify that the device is properly configured and that the clock and data signals are properly routed. Use an oscilloscope to check the signal integrity and look for signs of noise or distortion. Finally, consult the datasheet and application notes for troubleshooting guides and FAQs.
  • The MAX1490EAEPG+ has a maximum junction temperature of 150°C, and it's recommended to ensure the device operates within a temperature range of -40°C to 85°C. To ensure proper thermal operation, use a heat sink or thermal pad to dissipate heat, and avoid blocking airflow around the device. Additionally, use thermal simulation tools to estimate the device's temperature and ensure it's within the recommended range.

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MAX1490EAEPG+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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