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MAX14931AASE+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX14931AASE+ - Digital Isolator, 4 Channel, 42.9 ns, 1.71 V, 5.5 V, NSOIC, 16 Pins

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MAX14931AASE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S16M+11
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MAX14931AASE+ - Analog Devices  - 3D model - Small Outline Packages - S16M+11
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MAX14931AASE+ Details

  • Manufacturer Part Number:

    MAX14931AASE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-SOIC_N-150_MIL

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2014-10-24

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX14931AASE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX14931AASE+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable communication between the MAX14931AASE+ and the microcontroller, make sure to use a proper SPI interface configuration, including correct clock polarity and phase settings. Also, ensure that the microcontroller's SPI clock frequency is within the recommended range of 1MHz to 10MHz.
  • The maximum cable length supported by the MAX14931AASE+ depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 100kbps. For longer cable lengths, it's recommended to use repeaters or amplifiers to ensure signal integrity.
  • The MAX14931AASE+ has built-in error detection and fault handling mechanisms, including parity checking and error flags. It's recommended to implement error handling routines in the microcontroller to detect and respond to errors, such as retrying failed transmissions or resetting the device in case of a fault.
  • Yes, the MAX14931AASE+ is designed to support hot-swapping, which allows devices to be connected or disconnected without powering down the system. However, it's essential to ensure that the power supply and signal lines are properly isolated during hot-swapping to prevent damage to the device or the system.

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MAX14931AASE+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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