Part Image

MAX15090EWI+T - Analog Devices

Description: Integration Reduces Solution Size for Blade Servers and Other Space-Constrained Designs • Integrated 6mω (typ) Internal Power MOSFET Overvoltage Protection • Power-Good and Fault Outputs • Programmable Undervoltage Lockout • Current Reporting Without Need for External RSENSE • Thermal Protection ● Flexibility Enables Use in Many Unique Designs • 2.7V to 18V Operating Voltage Range • Adjustable Circuit-Breaker Current/Current-Limit Threshold • Programmable Slew-Rate Control • Variable-Speed Cir

Download MAX15090EWI+T Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
MAX15090EWI+T - Analog Devices PCB footprint - BGA - BGA - PACKAGE OUTLINE, 28 BUMPS WLP PKG. (HIGH CURRENT), 0.5 MM PITCH.
click to zoom
3D Models
MAX15090EWI+T - Analog Devices  - 3D model - BGA - PACKAGE OUTLINE, 28 BUMPS WLP PKG. (HIGH CURRENT), 0.5 MM PITCH.
click to zoom

MAX15090EWI+T Details

  • Manufacturer Part Number:

    MAX15090EWI+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    28-WLCSP-N/A

  • Package Description:

    2.07 X 3.53 MM, ROHS COMPLIANT, WLP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    28-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2012-10-08

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Analog IC - Other Type:

    HOT SWAP CONTROLLER

  • JESD-30 Code:

    R-PBGA-B28

  • Length:

    3.525 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA28,4X7,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.69 mm

  • Supply Current-Max (Isup):

    0.75 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.065 mm

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MAX15090EWI+T Overview

Use the download button to access the MAX15090EWI+T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX15, or try a keyword search, such as Power Management Circuits

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

Parts related to MAX15090EWI+T

Showing 0 results