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MAX16129UAAGA+ - Analog Devices

Description: Load-Dump/Reverse-Voltage Protection Circuits

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MAX16129UAAGA+ - Analog Devices PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - 21-0036 UL UMAX
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MAX16129UAAGA+ - Analog Devices  - 3D model - SOT23 (8-Pin) - 21-0036 UL UMAX
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MAX16129UAAGA+ Details

  • Manufacturer Part Number:

    MAX16129UAAGA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-MINI_SO-N/A

  • Package Description:

    MICROMAX-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2012-10-04

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    THE UV THRESHOLD VOLTAGE IS 3 V, THE OV THRESHOLD VOLTATE IS 31.62 V

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    INPUT FAULT PROTECTION CONTROLLER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.38 mA

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3V,31.62V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX16129UAAGA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX16129UAAGA+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the battery. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • The MAX16129UAAGA+ does not require calibration for voltage measurements, as it has an internal voltage reference. However, for current measurements, calibration is required to compensate for the sense resistor's tolerance. This can be done by measuring the sense resistor's value and adjusting the calibration register accordingly.
  • The MAX16129UAAGA+ has an operating temperature range of -40°C to +125°C, making it suitable for most industrial and automotive applications.
  • Yes, the MAX16129UAAGA+ is designed to support hot-swap applications. It has an internal power-on reset (POR) circuit that ensures the device powers up correctly even when the input voltage is applied suddenly.
  • The MAX16129UAAGA+ has a 2-wire I²C interface that can be easily connected to a microcontroller. The device's address can be set using the ADDR pin, and the microcontroller can read data from the device using the I²C protocol.

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MAX16129UAAGA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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