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MAX1614EUA+ - Analog Devices

Description: MAX1614EUA+, MOSFET Power Driver, 5 to 26V, 8-Pin µMAX

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MAX1614EUA+ - Analog Devices - PCB symbol
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PCB Footprints
MAX1614EUA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U8+1 _
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MAX1614EUA+ - Analog Devices - 3D model - Small Outline Packages - U8+1 _
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MAX1614EUA+ Details

  • Manufacturer Part Number:

    MAX1614EUA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-MINI_SO-N/A

  • Package Description:

    ROHS COMPLIANT, UMAX-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1996-12-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.04 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX1614EUA+ Frequently Asked Questions (FAQs)

  • The MAX1614EUA+ requires careful layout and placement to ensure proper operation. It is recommended to follow the layout guidelines provided in the datasheet, including keeping the input and output traces short and away from noise sources, and using a solid ground plane to reduce noise and improve thermal performance.
  • The MAX1614EUA+ has a built-in thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C. To handle this feature, ensure that the device is properly heatsinked, and consider adding thermal monitoring and shutdown circuitry to prevent damage to the device and surrounding components.
  • The recommended input voltage range for the MAX1614EUA+ is 4.5V to 5.5V, although the device can operate with input voltages as low as 4V. However, operating the device outside of the recommended range may affect its performance and reliability.
  • To ensure the accuracy of the voltage monitoring function, ensure that the input voltage is within the recommended range, and that the device is properly calibrated. Additionally, consider using a high-precision voltage reference and ensuring that the input voltage is noise-free and stable.
  • The EN (enable) pin on the MAX1614EUA+ is used to enable or disable the device. When the EN pin is pulled low, the device is disabled, and when it is pulled high, the device is enabled. This pin can be used to power down the device when not in use to reduce power consumption.

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MAX1614EUA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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