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MAX187ACWE+ - Analog Devices

Description: +5V, Low-Power, 12-Bit Serial ADCs

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MAX187ACWE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16 SO
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MAX187ACWE+ - Analog Devices  - 3D model - Small Outline Packages - 16 SO
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MAX187ACWE+ Details

  • Manufacturer Part Number:

    MAX187ACWE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-SOIC_W-300_MIL

  • Package Description:

    DIP-8

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-SOIC_W-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    1993-10-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    4.096 V

  • Conversion Time-Max:

    8.5 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.375 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.075 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    4.572 mm

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.62 mm

MAX187ACWE+ Frequently Asked Questions (FAQs)

  • The MAX187ACWE+ requires careful layout and placement to minimize noise and ensure optimal performance. It is recommended to place the device close to the power source, use a solid ground plane, and keep the input and output traces separate. Additionally, it is recommended to use a 10uF ceramic capacitor between the VIN and GND pins to filter out noise.
  • The output capacitor selection depends on the output voltage, output current, and desired ripple voltage. A general rule of thumb is to use a capacitor with a value between 10uF to 100uF, with a voltage rating of at least 1.5 times the output voltage. It is also recommended to use a low-ESR capacitor to minimize ripple voltage.
  • The MAX187ACWE+ can handle input voltages up to 28V, but it is recommended to operate within the specified input voltage range of 4.5V to 16V for optimal performance and reliability.
  • The MAX187ACWE+ has a built-in overcurrent protection feature that can be enabled by connecting a resistor between the OCSET pin and the GND pin. The value of the resistor determines the overcurrent threshold. It is recommended to use a 1kΩ resistor for a 1A overcurrent threshold.
  • The MAX187ACWE+ has a thermal shutdown temperature of 150°C. If the device temperature exceeds this threshold, it will shut down to prevent damage.

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MAX187ACWE+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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