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MAX211IDBR - Texas Instruments

Description: 5-V Multichannel RS-232 Line Driver/Receiver with +/-15-kV ESD Protection

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MAX211IDBR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DB0028A
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MAX211IDBR - Texas Instruments  - 3D model - Small Outline Packages - DB0028A
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MAX211IDBR Details

  • Manufacturer Part Number:

    MAX211IDBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    NO

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.0002 A

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-F; TIA-232-F; V.28

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e4

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.0016 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1000 ns

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

MAX211IDBR Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX211IDBR involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The MAX211IDBR requires a single 3.3V power supply. It's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the device after the power supply has stabilized, and to ensure that the power supply is within the recommended operating range.
  • The recommended clocking scheme for the MAX211IDBR is to use a low-jitter clock source, such as a crystal oscillator or a phase-locked loop (PLL). To minimize clock jitter, it's recommended to use a clock source with a jitter of less than 100 ps, and to use a clock distribution network with a low skew and low jitter.
  • To optimize the MAX211IDBR's performance, consider the following key parameters: gain, bandwidth, noise figure, and power consumption. Optimize the device's performance by selecting the appropriate gain setting, adjusting the bandwidth to match the signal frequency, and minimizing noise figure by using a low-noise amplifier and a high-quality power supply.
  • The MAX211IDBR has a maximum junction temperature of 150°C. To ensure the device operates within its recommended temperature range, use a heat sink or a thermal pad to dissipate heat, and ensure good airflow around the device. Additionally, use a thermal interface material to improve heat transfer between the device and the heat sink or thermal pad.

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MAX211IDBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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