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MAX2248ETE+ - Analog Devices

Description: 1.9GHz Power Amplifier, TQFN16

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PCB Footprints
MAX2248ETE+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T1633+5-2020
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3D Models
MAX2248ETE+ - Analog Devices  - 3D model - Quad Flat No-Lead - T1633+5-2020
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MAX2248ETE+ Details

  • Manufacturer Part Number:

    MAX2248ETE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-LFCSP-3X3X0.75

  • Package Description:

    TOFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-LFCSP-3X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2017-08-09

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    3.2 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX2248ETE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX2248ETE+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the antenna. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the device's exposed pad should be connected to the ground plane.
  • To optimize the performance of the MAX2248ETE+, you should consider factors such as the antenna design, PCB layout, and component selection. You can also use simulation tools such as ADS or AWR to model the device's behavior and optimize its performance. Additionally, Analog Devices provides an evaluation board and software tools to help with device evaluation and optimization.
  • The MAX2248ETE+ has an operating temperature range of -40°C to +85°C. However, the device's performance may degrade at higher temperatures, and it's recommended to operate it within a temperature range of -20°C to +70°C for optimal performance.
  • While the MAX2248ETE+ is designed for 50Ω systems, it can be used in non-50Ω systems with some adjustments. You'll need to use impedance-matching networks to match the device's input and output impedances to the system's impedance. However, this may affect the device's performance and require additional components.
  • To troubleshoot issues with the MAX2248ETE+, start by checking the device's power supply, clock, and data signals. Use an oscilloscope to verify the signal integrity and check for any signs of signal degradation or distortion. You can also use Analog Devices' evaluation board and software tools to help identify and debug issues.

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MAX2248ETE+ Overview

Use the download button to access the MAX2248ETE+ schematic symbol, PCB footprint, and 3D model.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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