Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA
HTS Code:
8542.31.00.30
Date Of Intro:
2011-04-14
Manufacturer:
Analog Devices Inc
YTEOL:
10
Boundary Scan:
NO
Bus Compatibility:
I2C; USB
Clock Frequency-Max:
35 MHz
Communication Protocol:
ASYNC, BIT; SYNC, BYTE
Data Transfer Rate-Max:
3 MBps
JESD-30 Code:
S-XQCC-N32
JESD-609 Code:
e3
Low Power Mode:
YES
Moisture Sensitivity Level:
1
Number of Serial I/Os:
2
Number of Terminals:
32
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Code:
HQCCN
Package Equivalence Code:
LCC32,.2SQ,20
Package Shape:
SQUARE
Package Style:
CHIP CARRIER, HEAT SINK/SLUG
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Supply Voltage-Max:
3.6 V
Supply Voltage-Min:
1.71 V
Supply Voltage-Nom:
1.8 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
uPs/uCs/Peripheral ICs Type:
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
MAX3109ETJ+T Frequently Asked Questions (FAQs)
The recommended layout and routing for the MAX3109ETJ+T involves keeping the analog and digital signals separate, using a solid ground plane, and minimizing the length of the traces between the device and the crystal oscillator. A 4-layer PCB with a dedicated analog ground plane is recommended. Additionally, the device's exposed pad should be connected to a solid ground plane to improve thermal performance.
To ensure reliable startup of the MAX3109ETJ+T, it is recommended to use a high-quality crystal oscillator with a suitable load capacitance, and to ensure that the power supply voltage is stable and within the recommended range. Additionally, the device's power-on reset (POR) circuit should be allowed to complete its reset cycle before attempting to access the device.
The maximum frequency of operation for the MAX3109ETJ+T is 100MHz, although the device can operate at frequencies up to 150MHz with reduced performance. The device's performance and power consumption will degrade at higher frequencies, so it is recommended to operate the device within the specified frequency range for optimal performance.
During power-down and power-up sequences, the MAX3109ETJ+T's FIFO buffers should be emptied or flushed to prevent data corruption. This can be done by reading or writing to the FIFO buffers before powering down the device, and by waiting for the device to complete its power-up sequence before accessing the FIFO buffers.
The MAX3109ETJ+T has a maximum junction temperature of 150°C, and it is recommended to keep the device's junction temperature below 125°C for optimal performance and reliability. Thermal management considerations include using a heat sink, ensuring good airflow, and minimizing the device's power consumption.
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MAX3109ETJ+T Overview
Use the download button to access the MAX3109ETJ+T 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Analog Devices
Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries.
Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.
