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MAX3218EAP+ - Analog Devices

Description: BETTER THAN BIPOLAR! ♦ 1µA Supply Current Using AutoShutdown ♦ Operates Directly from Two Alkaline, NiCd or NiMH Cells ♦ +1.8V to +4.25V Single-Supply Voltage Range ♦ 120kbps Data Rate Guaranteed ♦ Low-Cost Surface-Mount Components ♦ Meets EIA/TIA-232E Specifications ♦ Three-State Receiver Outputs ♦ Flow-Through Pinout ♦ On-Board DC-DC Converters ♦ 20-Pin SSOP and DIP Packages

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MAX3218EAP+ - Analog Devices - PCB symbol
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PCB Footprints
MAX3218EAP+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 20 SSOP
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3D Models
MAX3218EAP+ - Analog Devices - 3D model - Small Outline Packages - 20 SSOP
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MAX3218EAP+ Details

  • Manufacturer Part Number:

    MAX3218EAP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-SSOP-5.3_MM

  • Package Description:

    SSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-SSOP-5.3_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1995-03-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    EXTERNAL CHARGE PUMP; TRISTATABLE RECEIVERS; AUTO SHUTDOWN

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-E; V.24; V.28; EIA-562

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    7.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.001 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1000 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.99 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    4.25 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2700 ns

  • Width:

    5.29 mm

MAX3218EAP+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX3218EAP+ involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing the device close to the battery or power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure the MAX3218EAP+ is properly powered up and initialized, make sure to follow the power-up sequence specified in the datasheet, which involves applying the power supply voltage (VCC) before the battery voltage (VBAT). Also, ensure that the EN pin is high during power-up and that the device is properly configured through the I2C interface.
  • The key considerations for thermal management when using the MAX3218EAP+ include ensuring good airflow around the device, using a heat sink if necessary, and keeping the device away from high-temperature components. Additionally, it's recommended to follow the thermal design guidelines provided in the datasheet to ensure the device operates within its specified temperature range.
  • To troubleshoot issues with the MAX3218EAP+, start by checking the power supply voltage and ensuring that it's within the specified range. Then, verify that the device is properly configured through the I2C interface and that the EN pin is high. Use a logic analyzer or oscilloscope to monitor the I2C bus and verify that the device is responding correctly. Finally, check the device's status registers to identify any error conditions.
  • When using the MAX3218EAP+ in a high-vibration or high-shock environment, it's essential to ensure that the device is properly secured to the PCB and that the PCB is designed to withstand the mechanical stresses. Additionally, consider using a device with a higher vibration rating or implementing additional mechanical protection measures such as potting or conformal coating.

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MAX3218EAP+ Overview

Use the download button to access the MAX3218EAP+ schematic symbol, PCB footprint, and 3D model.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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