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MAX3232EEUE+T - Analog Devices

Description: RS-232 Interface IC +/-15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers

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PCB Footprints
MAX3232EEUE+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U16+1
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MAX3232EEUE+T - Analog Devices  - 3D model - Small Outline Packages - U16+1
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MAX3232EEUE+T Details

  • Manufacturer Part Number:

    MAX3232EEUE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-TSSOP_4.4-4.4_MM

  • Package Description:

    4.40 MM, MO-153, TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-TSSOP_4.4-4.4_MM

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2002-03-29

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; TIA-232; V.24; V.28

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Output Low Current-Max:

    0.0016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX3232EEUE+T Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the signal traces short and away from noise sources. Also, use a common mode choke or ferrite bead to filter the power supply lines.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) as close as possible to the VCC pin, and add a 100nF capacitor in parallel to filter high-frequency noise. Also, ensure the power supply is clean and regulated.
  • The MAX3232EEUE+T can support cable lengths up to 100 meters (330 feet) at a data rate of 250 kbps, but this may vary depending on the specific application and cable quality.
  • Use a logic analyzer or oscilloscope to monitor the signal quality and timing. Check for proper termination, signal attenuation, and noise coupling. Also, verify the baud rate, data format, and flow control settings.
  • Yes, the MAX3232EEUE+T can be used in a multi-point or multi-drop configuration, but it's essential to ensure proper signal termination, and consider using a repeater or hub to extend the distance and improve signal quality.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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