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MAX5900AAEUT+T - Analog Devices

Description: Hot Swap Voltage Controllers -100V, SOT23/TDFN, Simple Swapper Hot-Swap Controllers

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MAX5900AAEUT+T - Analog Devices - PCB symbol
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PCB Footprints
MAX5900AAEUT+T - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - U6F+6
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3D Models
MAX5900AAEUT+T - Analog Devices - 3D model - SOT23 (6-Pin) - U6F+6
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MAX5900AAEUT+T Details

  • Manufacturer Part Number:

    MAX5900AAEUT+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    6-SOT_23-N/A

  • Package Description:

    LSSOP, TSOP6,.11,37

  • Pin Count:

    6

  • Manufacturer Package Code:

    6-SOT_23-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2001-07-21

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    IT OPERATES FROM A -9V TO -100V NEGATIVE SUPPLY

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    HOT SWAP CONTROLLER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -48 V

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max (Isup):

    1.3 mA

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.625 mm

MAX5900AAEUT+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX5900AAEUT+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure proper power-up and initialization, make sure to follow the power-up sequence recommended in the datasheet. Apply the power supply to the device in the correct order (VCC, then VIN), and ensure that the input voltage is within the recommended range. Also, make sure to add a 10nF capacitor between the EN pin and GND to filter out noise and ensure proper enable functionality.
  • The maximum current that the MAX5900AAEUT+T can deliver depends on the input voltage, output voltage, and ambient temperature. The device can deliver up to 1A of output current. To calculate the output current capability, refer to the datasheet's output current vs. input voltage and output voltage graphs, and consider the device's thermal limitations and power dissipation.
  • To protect the MAX5900AAEUT+T from overvoltage and undervoltage conditions, use external voltage protection devices such as TVS diodes or voltage supervisors. These devices can detect and respond to voltage faults, and can be used to shut down the device or trigger an alarm in case of an overvoltage or undervoltage event.
  • The thermal management strategy for the MAX5900AAEUT+T involves using a heat sink or a thermal pad to dissipate heat. To calculate the junction temperature, use the thermal resistance values provided in the datasheet, and consider the device's power dissipation, ambient temperature, and airflow. You can also use thermal simulation tools to estimate the junction temperature.

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MAX5900AAEUT+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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