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MAX5955BEEE+ - Analog Devices

Description: Hot Swap Voltage Controllers Low-Voltage, Dual Hot-Swap Controllers with Independent On/Off Control

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MAX5955BEEE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16 QSOP
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MAX5955BEEE+ - Analog Devices  - 3D model - Small Outline Packages - 16 QSOP
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MAX5955BEEE+ Details

  • Manufacturer Part Number:

    MAX5955BEEE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    0.150 INCH, 0.025 INCH PITCH, LEAD FREE, MO-137AB, QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2005-11-04

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    HOT SWAP CONTROLLER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    2.3 mA

  • Supply Voltage-Max (Vsup):

    13.2 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX5955BEEE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX5955BEEE+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure proper power-up and power-down of the MAX5955BEEE+, it's essential to follow a controlled power-up sequence. The device should be powered up in the following order: VCC, VDD, and then VIN. During power-down, the sequence should be reversed. Additionally, the power supplies should be ramped up and down slowly to prevent voltage spikes and ensure a clean shutdown.
  • The MAX5955BEEE+ can drive a maximum capacitive load of 10nF. Exceeding this limit may cause the device to oscillate or become unstable. If a larger capacitive load is required, an external buffer or a capacitor divider network can be used to reduce the load capacitance.
  • To troubleshoot issues with the MAX5955BEEE+ not outputting the correct voltage, first check the input voltage and ensure it's within the recommended range. Verify that the device is properly powered up and that the output voltage is not overloaded. Check for any short circuits or excessive current draw on the output. Also, ensure that the device is not overheating, and that the thermal shutdown is not activated.
  • The MAX5955BEEE+ is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to follow the recommended operating conditions and ensure proper thermal management, such as using a heat sink or a thermal interface material, to prevent overheating.

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MAX5955BEEE+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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Part Image MAX5955BUEE+ Rochester Electronics LLC

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Part Image MAX5955BEEE+T Analog Devices Inc

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Part Image MAX5955BEEE+ Maxim Integrated Products

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Part Image MAX5955BUEE+ Maxim Integrated Products

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Part Image MAX5955BUEE-T Maxim Integrated Products

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For a full list of alternate parts for MAX5955BEEE+, check out Findchips.com