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MAX6023EBT25+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX6023EBT25+T - VOLTAGE REF, SERIES, 2.5V, UCSP-5

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MAX6023EBT25+T - Analog Devices PCB footprint - BGA - BGA - B6+4
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MAX6023EBT25+T - Analog Devices  - 3D model - BGA - B6+4
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MAX6023EBT25+T Details

  • Manufacturer Part Number:

    MAX6023EBT25+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    N/A

  • Package Description:

    VFBGA, BGA6,2X3,20

  • Pin Count:

    6

  • Manufacturer Package Code:

    N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2001-10-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PBGA-B5

  • JESD-609 Code:

    e1

  • Length:

    1.52 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.505 V

  • Output Voltage-Min:

    2.495 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.67 mm

  • Supply Voltage-Max (Vsup):

    12.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temp Coef of Voltage-Max:

    30 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.2%

  • Width:

    1 mm

MAX6023EBT25+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX6023EBT25+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended PCB layout, use a sufficient output capacitor (at least 10uF), and keep the input and output impedance matched. Also, avoid using long input traces and ensure that the device is properly decoupled.
  • The maximum input voltage that the MAX6023EBT25+T can handle is 30V, but it's recommended to keep the input voltage below 28V to ensure reliable operation and to prevent damage to the device.
  • The MAX6023EBT25+T is rated for operation up to 125°C, but its performance may degrade at high temperatures. It's recommended to derate the output current and voltage at high temperatures to ensure reliable operation.
  • To troubleshoot issues with the MAX6023EBT25+T, start by checking the input voltage, output current, and PCB layout. Use an oscilloscope to check for oscillations or noise on the output. Also, verify that the device is properly decoupled and that the output capacitor is sufficient.

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MAX6023EBT25+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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