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MAX6226ALA25+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX6226ALA25+ - VOLT REF, SERIES, 2.5V, -40 TO 125DEG C

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MAX6226ALA25+ - Analog Devices PCB footprint - Other - Other - MAX6226ALA25+-2
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MAX6226ALA25+ - Analog Devices  - 3D model - Other - MAX6226ALA25+-2
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MAX6226ALA25+ Details

  • Manufacturer Part Number:

    MAX6226ALA25+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-LCC-3.8X3.8X1.48

  • Package Description:

    LCC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-LCC-3.8X3.8X1.48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-04-09

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    S-CQCC-N8

  • Length:

    3.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.52502 V

  • Output Voltage-Min:

    2.52502 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC8,.15SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Seated Height-Max:

    1.66 mm

  • Supply Voltage-Max (Vsup):

    12.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temp Coef of Voltage-Max:

    3 ppm/°C

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.02%

  • Width:

    3.8 mm

MAX6226ALA25+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX6226ALA25+ involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure the MAX6226ALA25+ is stable and doesn't oscillate, it's essential to follow the recommended layout and placement guidelines, use a sufficient decoupling capacitor, and ensure the input and output capacitors are properly sized. Additionally, the device should be operated within its recommended operating conditions, and the output should not be overloaded.
  • The maximum output current capability of the MAX6226ALA25+ is 500mA. However, it's recommended to derate the output current based on the ambient temperature and the device's power dissipation to ensure reliable operation.
  • The MAX6226ALA25+ is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the output current and ensure proper heat sinking to maintain reliable operation in high-temperature environments.
  • To troubleshoot issues with the MAX6226ALA25+, start by verifying the input voltage, output voltage, and output current. Check for any signs of overheating, and ensure the device is properly soldered and connected. Use an oscilloscope to check for any oscillations or noise on the output. If the issue persists, consult the datasheet and application notes for further guidance.

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MAX6226ALA25+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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