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MAX77642ANA+ - Analog Devices

Description: Power Management Specialized - PMIC Ultra-Low Power PMIC Featuring Single- Inductor, 3-Output Buck-Boost, 2-LDOs

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MAX77642ANA+ - Analog Devices PCB footprint - BGA - BGA - 21-100480
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MAX77642ANA+ - Analog Devices  - 3D model - BGA - 21-100480
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MAX77642ANA+ Details

  • Manufacturer Part Number:

    MAX77642ANA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    25-WLCSP-N/A

  • Package Description:

    WLP-25

  • Pin Count:

    25

  • Manufacturer Package Code:

    25-WLCSP-N/A

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-10-13

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XBGA-B25

  • Length:

    2.058 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.7 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    2.6

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.058 mm

MAX77642ANA+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX77642ANA+ can be found in the MAX77642 Evaluation Kit (EV Kit) documentation and layout files, which provide a reference design for optimal performance and thermal management.
  • The power-up sequence for the MAX77642ANA+ should follow the recommended power-up sequence in the datasheet, which involves powering up the input voltage (VIN) first, followed by the enable pin (EN), and then the output voltage (VOUT). Additionally, the power-up sequence should be controlled by a dedicated power management IC or a microcontroller to ensure a smooth and reliable startup.
  • The maximum input voltage that the MAX77642ANA+ can handle is 5.5V, as specified in the datasheet. However, it's recommended to operate the device within the recommended input voltage range of 3.5V to 5V for optimal performance and reliability.
  • To troubleshoot issues with the MAX77642ANA+ output voltage regulation, check the input voltage, output voltage, and enable pin (EN) status using an oscilloscope or a multimeter. Also, verify that the output capacitor and input capacitor values meet the recommended specifications in the datasheet. If the issue persists, consult the MAX77642ANA+ application note and the Analog Devices support team for further assistance.
  • The MAX77642ANA+ is rated for operation up to 85°C (junction temperature), but it's recommended to operate the device within a temperature range of -40°C to 70°C for optimal performance and reliability. For high-temperature applications, consider using a heat sink or a thermal management solution to keep the device temperature within the recommended range.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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