Please enter a minimum 3 letters or numbers
Technical Content
Part Image

MAX77675AEWE+ - Analog Devices

Description: 4x Buck/Buck-Boost/Boost Regulators, 1x Inductor 2.5V to 5.5V Input Voltage Range0.5V to 5.5V Output Voltage Range 700mA Total Output Current (3.7VIN, 1.8VOUT) SIMO Up to 90% Efficiency6.9μA Typical IQ with Two Outputs Enabled in Low-Power Mode I2C Interface and Dedicated Enable Pin Flexible Power Sequencer (FPS) 1.99mm x 1.99mm, 16-Bump, 0.5mm Pitch Wafer-Level Package (WLP)

Download MAX77675AEWE+ Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
MAX77675AEWE+ - Analog Devices - PCB symbol
click to zoom
PCB Footprints
MAX77675AEWE+ - Analog Devices PCB footprint - BGA - BGA - MAX77675AEWE+-
click to zoom
3D Models
MAX77675AEWE+ - Analog Devices - 3D model - BGA - MAX77675AEWE+-
click to zoom

MAX77675AEWE+ Details

  • Manufacturer Part Number:

    MAX77675AEWE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-WLCSP-N/A

  • Package Description:

    WLP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-WLCSP-N/A

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2023-03-16

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XBGA-B16

  • Length:

    1.988 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    3.7 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +2.3V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.988 mm

MAX77675AEWE+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX77675AEWE+ can be found in the MAX77675AEWE+ Evaluation Kit User Guide (UG-1143) and the MAX77675AEWE+ Layout Guidelines document, both available on the Analog Devices website. These resources provide detailed guidance on component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The MAX77675AEWE+ can be configured using the MAX77675AEWE+ Evaluation Kit and the accompanying software tools, such as the MAX77675AEWE+ GUI and the MAX77675AEWE+ Register Map document. These tools allow you to adjust settings, monitor performance, and optimize the device for your specific application.
  • The MAX77675AEWE+ has a maximum junction temperature of 125°C. To ensure reliable operation, it is essential to provide adequate thermal management, such as heat sinking, thermal vias, and airflow. The MAX77675AEWE+ Thermal Management document provides detailed guidance on thermal design and layout considerations.
  • Troubleshooting issues with the MAX77675AEWE+ can be done using the MAX77675AEWE+ Debug Guide, which provides a step-by-step approach to identifying and resolving common issues. Additionally, the MAX77675AEWE+ FAQs and Knowledge Base articles on the Analog Devices website offer solutions to frequently encountered problems.
  • The MAX77675AEWE+ is designed to meet EMI and EMC requirements, but it is still essential to follow proper design and layout practices to minimize electromagnetic interference. The MAX77675AEWE+ EMI and EMC document provides guidance on design considerations, layout techniques, and testing methods to ensure compliance with relevant standards.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MAX77675AEWE+ Overview

Use the download button to access the MAX77675AEWE+ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX77, or try a keyword search, such as Power Management Circuits

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

Parts related to MAX77675AEWE+

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑