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MAX77714GEWC+T - Analog Devices

Description: Next generation AP PMIC

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MAX77714GEWC+T - Analog Devices PCB footprint - BGA - BGA - W703A4+1-1
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MAX77714GEWC+T - Analog Devices  - 3D model - BGA - W703A4+1-1
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MAX77714GEWC+T Details

  • Manufacturer Part Number:

    MAX77714GEWC+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    70-WLCSP-N/A

  • Package Description:

    WLP-70

  • Pin Count:

    70

  • Manufacturer Package Code:

    70-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-06-12

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    R-XBGA-B70

  • Length:

    4.118 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    70

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA70,7X10,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.6 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +2.5V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.167 mm

MAX77714GEWC+T Frequently Asked Questions (FAQs)

  • Analog Devices provides a recommended PCB layout in the MAX77714 evaluation kit documentation, which can be found on the product page. It's essential to follow the recommended layout to ensure proper thermal performance and minimize electromagnetic interference (EMI).
  • To optimize the MAX77714GEWC+T for low-power operation, ensure that the input voltage is as close to the output voltage as possible. Also, adjust the output voltage to the minimum required by the system, and use the lowest possible switching frequency. Additionally, consider using a low-power mode or shutdown mode when the system is in standby or idle.
  • The maximum ambient temperature for the MAX77714GEWC+T is 105°C. However, the device's thermal performance and reliability may degrade at higher temperatures. It's recommended to keep the ambient temperature below 85°C for most applications.
  • Yes, the MAX77714GEWC+T is designed to withstand high-vibration environments. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • To troubleshoot issues with the MAX77714GEWC+T output voltage, first, verify that the input voltage and output voltage settings are correct. Then, check the output voltage using an oscilloscope or a multimeter. If the output voltage is not within the expected range, check for signs of overheating, and ensure that the device is properly cooled. Finally, consult the datasheet and application notes for troubleshooting guidelines.

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MAX77714GEWC+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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