Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Date Of Intro:
2020-07-24
Manufacturer:
Analog Devices Inc
YTEOL:
8.5
Adjustable Threshold:
YES
Analog IC - Other Type:
USB PD CONTROLLER
JESD-30 Code:
S-XQCC-N24
JESD-609 Code:
e3
Length:
3 mm
Moisture Sensitivity Level:
1
Number of Channels:
1
Number of Functions:
1
Number of Terminals:
24
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Code:
VQCCN
Package Equivalence Code:
LCC24,.12SQ,16
Package Shape:
SQUARE
Package Style:
CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
0.6 mm
Supply Current-Max (Isup):
4 mA
Supply Voltage-Max (Vsup):
13.7 V
Supply Voltage-Min (Vsup):
4.5 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
NO LEAD
Terminal Pitch:
0.4 mm
Terminal Position:
QUAD
Threshold Voltage-Nom:
+13.7V
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
MAX77751CEFG+ Frequently Asked Questions (FAQs)
The recommended layout and placement for the MAX77751CEFG+ can be found in the MAX77751 Evaluation Kit documentation and the MAX77751 Layout Guidelines application note. It is essential to follow these guidelines to ensure proper operation and minimize noise and EMI.
To optimize the performance of the MAX77751CEFG+, it is recommended to consult the MAX77751 datasheet and application notes, and to contact Analog Devices' technical support team for guidance on specific design considerations, such as input capacitor selection, output capacitor selection, and PCB layout.
The MAX77751CEFG+ has a thermal pad that must be connected to a thermal plane on the PCB to ensure proper heat dissipation. The thermal resistance of the package is specified in the datasheet, and the device's junction temperature must be kept below the maximum rating to ensure reliability and prevent thermal shutdown.
To troubleshoot issues with the MAX77751CEFG+, it is recommended to consult the MAX77751 datasheet and application notes, and to use debugging tools such as oscilloscopes and logic analyzers to identify the source of the issue. Analog Devices' technical support team can also provide guidance and support to help resolve issues.
The MAX77751CEFG+ is designed to meet EMI and EMC standards, but proper PCB layout, component selection, and shielding are still necessary to ensure compliance. It is recommended to consult the MAX77751 datasheet and application notes, and to follow industry best practices for EMI and EMC design.
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MAX77751CEFG+ Overview
Use the download button to access the MAX77751CEFG+ 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Analog Devices
Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries.
Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.
