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MAX77962EWJ12+T - Analog Devices

Description: 23VIN 3.2AOUT USB-C Buck-Boost Charger with Integrated FETs for 2S Li-Ion Batteries

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PCB Footprints
MAX77962EWJ12+T - Analog Devices PCB footprint - BGA - BGA - W493G3+1
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MAX77962EWJ12+T - Analog Devices  - 3D model - BGA - W493G3+1
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MAX77962EWJ12+T Details

  • Manufacturer Part Number:

    MAX77962EWJ12+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    49-WLCSP-N/A

  • Package Description:

    WLP-49

  • Pin Count:

    49

  • Manufacturer Package Code:

    49-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-06-29

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-PBGA-B49

  • Length:

    3.458 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    49

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA49,7X7,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Voltage-Max (Vsup):

    23 V

  • Supply Voltage-Min (Vsup):

    3.5 V

  • Supply Voltage-Nom (Vsup):

    9 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +3.5V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.458 mm

MAX77962EWJ12+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX77962EWJ12+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 1uF to 10uF, and the output capacitor should be a low-ESR ceramic capacitor with a value between 2.2uF to 22uF. The capacitor selection also depends on the output voltage and current requirements.
  • The MAX77962EWJ12+T has an operating temperature range of -40°C to +125°C, but the maximum ambient temperature range depends on the specific application and the thermal design of the system. It's recommended to follow the thermal design guidelines in the datasheet to ensure reliable operation.
  • The output voltage of the MAX77962EWJ12+T can be configured using the FB pin and an external resistor divider network. The datasheet provides a formula to calculate the required resistor values for a specific output voltage. Additionally, the device has a built-in voltage regulator that can be programmed using the I2C interface.
  • The maximum output current capability of the MAX77962EWJ12+T is 2A, but it depends on the input voltage, output voltage, and thermal design of the system. The device has an overcurrent protection feature that limits the output current to prevent damage.

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MAX77962EWJ12+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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