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MAX803SQ308T1G - onsemi

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Symbol
MAX803SQ308T1G - onsemi - PCB symbol
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PCB Footprints
MAX803SQ308T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04
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3D Models
MAX803SQ308T1G - onsemi - 3D model - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04
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MAX803SQ308T1G Details

  • Manufacturer Part Number:

    MAX803SQ308T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.1 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.0025 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.08V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.24 mm

MAX803SQ308T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX803SQ308T1G involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance.
  • To ensure proper power-up and initialization, apply a monotonic power supply ramp-up, and ensure that the input voltage reaches the minimum specified voltage (1.8V) before enabling the device. Also, ensure that the EN pin is properly biased to enable the device.
  • The MAX803SQ308T1G has a thermal junction-to-ambient thermal resistance of 125°C/W. To prevent overheating, ensure good airflow, use a heat sink if necessary, and avoid operating the device near its maximum junction temperature (150°C).
  • To troubleshoot issues with the MAX803SQ308T1G, check the input voltage, output load, and PCB layout for any anomalies. Verify that the device is properly powered up and initialized, and check for any signs of overheating or electrical overstress.
  • Yes, to minimize EMI/EMC issues, use a shielded enclosure, keep the device away from noise sources, and use a common-mode choke or ferrite bead on the input and output lines. Also, ensure that the PCB layout is designed to minimize radiated emissions.

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MAX803SQ308T1G Overview

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