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MAX809SQ293T1G - onsemi

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PCB Footprints
MAX809SQ293T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04
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3D Models
MAX809SQ293T1G - onsemi  - 3D model - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04
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MAX809SQ293T1G Details

  • Manufacturer Part Number:

    MAX809SQ293T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.1 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    SOT-323

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.0025 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.93V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.24 mm

MAX809SQ293T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX809SQ293T1G involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance.
  • To ensure proper power-up and power-down, follow the recommended power-up sequence, ensure a monotonic power supply ramp, and avoid hot-swapping the input voltage. Also, add a soft-start circuit to limit inrush current.
  • To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad. Also, follow the recommended PCB layout and thermal design guidelines.
  • To troubleshoot issues, check the input voltage, output load, and PCB layout. Verify that the device is properly powered up and down, and check for oscillations or noise on the output. Use an oscilloscope to visualize the output waveform and identify any anomalies.
  • Yes, to minimize EMI/EMC issues, use a shielded enclosure, keep the device away from noise sources, and use a common-mode choke or ferrite bead on the input. Also, follow good PCB layout practices and use a ground plane to reduce radiation.

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MAX809SQ293T1G Overview

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