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MAX96724FGTN/V+ - Analog Devices

Description: Quad Tunneling GMSL2/1 to CSI-2 Deserializer

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MAX96724FGTN/V+ - Analog Devices - PCB symbol
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PCB Footprints
MAX96724FGTN/V+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 56-LFCSP-8X8X0.75_2023-1
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3D Models
MAX96724FGTN/V+ - Analog Devices - 3D model - Quad Flat No-Lead - 56-LFCSP-8X8X0.75_2023-1
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MAX96724FGTN/V+ Details

  • Manufacturer Part Number:

    MAX96724FGTN/V+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    56-LFCSP-8X8X0.75

  • Package Description:

    TQFN-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    56-LFCSP-8X8X0.75

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Differential Output:

    NO

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    DESERIALIZER

  • Interface Standard:

    GMSL

  • JESD-30 Code:

    S-PQCC-N56

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    4

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.38 V

  • Output Characteristics:

    OPEN-DRAIN

  • Output Low Current-Max:

    0.004 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HWQCCN

  • Package Equivalence Code:

    LCC56,.32SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Receiver Number of Bits:

    4

  • Screening Level:

    AEC-Q100; ISO 26262-ASIL B

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    725 mA

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

MAX96724FGTN/V+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX96724FGTN/V+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to place the device near the power supply and use a low-ESR capacitor for the power supply decoupling.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, which is to apply VCC first, followed by VDD. Also, make sure to configure the device according to the datasheet, including setting the correct voltage levels, clock frequency, and configuration registers.
  • The MAX96724FGTN/V+ has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as using a thermal pad or heat sink, and to keep the device away from heat sources. Additionally, ensure good airflow around the device and avoid blocking the thermal pads.
  • To troubleshoot issues with the MAX96724FGTN/V+, start by reviewing the datasheet and application notes to ensure correct configuration and usage. Then, use debugging tools such as oscilloscopes, logic analyzers, or software debuggers to identify the source of the issue. Check for proper power supply, clock signals, and data transmission. If the issue persists, contact Analog Devices' technical support for further assistance.
  • Yes, the MAX96724FGTN/V+ is a high-frequency device and requires proper EMI/EMC design considerations. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference. Ensure that the device is placed in a shielded area, and use EMI filters on the input and output signals. Follow the recommended PCB layout and design guidelines to minimize radiation and susceptibility.

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MAX96724FGTN/V+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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