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MAX98396EWB+ - Analog Devices

Description: 20V Digital Input Class-DG Amplifier with I/V Sense and Brownout Prevention

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MAX98396EWB+ - Analog Devices - PCB symbol
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PCB Footprints
MAX98396EWB+ - Analog Devices PCB footprint - BGA - BGA - W352F3Z+1
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3D Models
MAX98396EWB+ - Analog Devices - 3D model - BGA - W352F3Z+1
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MAX98396EWB+ Details

  • Manufacturer Part Number:

    MAX98396EWB+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    35-WLCSP-N/A

  • Package Description:

    WLP-35

  • Pin Count:

    35

  • Manufacturer Package Code:

    35-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2021-03-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PBGA-B35

  • Length:

    2.998 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    35

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    25 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA35,5X7,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.168 mm

MAX98396EWB+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX98396EWB+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the audio codec. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and to follow the layout guidelines provided in the datasheet.
  • To optimize the performance of the MAX98396EWB+ in a noisy environment, it's recommended to use a good quality power supply, add decoupling capacitors, and use a shielded cable for the audio signal. Additionally, consider using a common-mode choke or a ferrite bead to filter out high-frequency noise.
  • The maximum power that the MAX98396EWB+ can deliver to a speaker depends on the supply voltage and the impedance of the speaker. According to the datasheet, the device can deliver up to 2.5W of power to a 4Ω speaker with a 5V supply voltage.
  • The MAX98396EWB+ can be configured for a specific audio application using the I2C interface. The device has several registers that can be programmed to set the gain, filter coefficients, and other parameters. Refer to the datasheet and the application notes for more information on how to configure the device for a specific application.
  • The MAX98396EWB+ and the MAX98357A are both audio codecs from Analog Devices, but they have some key differences. The MAX98396EWB+ is a higher-power device with a maximum output power of 2.5W, while the MAX98357A has a maximum output power of 1.2W. The MAX98396EWB+ also has a more advanced digital signal processing (DSP) engine and supports higher sample rates.

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MAX98396EWB+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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