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MBB02070C2003FCT00 - Vishay

Description: Vishay 200kΩ Thin Film Resistor 0.6W ±1% MBB02070C2003FCT00

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MBB02070C2003FCT00 - Vishay - PCB symbol
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PCB Footprints
MBB02070C2003FCT00 - Vishay PCB footprint - Resistors, Axial Diameter Horizontal Mounting - Resistors, Axial Diameter Horizontal Mounting - MBB/SMA 0207-2
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3D Models
MBB02070C2003FCT00 - Vishay - 3D model - Resistors, Axial Diameter Horizontal Mounting - MBB/SMA 0207-2
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MBB02070C2003FCT00 Details

  • Manufacturer Part Number:

    MBB02070C2003FCT00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    AXIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Czechia, India

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.90

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    9

  • Additional Feature:

    RATED AC VOLTAGE(V):350

  • Construction:

    Tubular

  • JESD-609 Code:

    e3

  • Lead Diameter:

    0.6 mm

  • Lead Length:

    28 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Diameter:

    2.5 mm

  • Package Length:

    6.5 mm

  • Package Style:

    Axial

  • Packing Method:

    AMMO PACK

  • Rated Power Dissipation (P):

    0.4 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    200000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Surface Mount:

    NO

  • Technology:

    METAL FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    TIN

  • Terminal Shape:

    WIRE

  • Tolerance:

    1%

  • Working Voltage:

    350 V

MBB02070C2003FCT00 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for MBB02070C2003FCT00 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.3 mm x 0.3 mm thermal pad in the center. The pad should be solder-mask defined (SMD) with a non-solder-mask-defined (NSMD) thermal pad.
  • To ensure proper thermal management, it is recommended to provide a thermal path from the device to a heat sink or a copper plane on the PCB. A thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K should be used to fill the gap between the device and the heat sink.
  • The maximum operating temperature range for MBB02070C2003FCT00 is -55°C to 150°C. However, the device can withstand storage temperatures up to 200°C for short periods.
  • Yes, MBB02070C2003FCT00 is suitable for high-reliability applications. It is built with a robust design and undergoes rigorous testing to ensure its performance and reliability in harsh environments.
  • To ensure the reliability of MBB02070C2003FCT00 in a humid environment, it is recommended to follow proper handling and storage procedures, such as storing the devices in a dry, nitrogen-filled environment, and using a moisture-sensitive device (MSD) label.

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MBB02070C2003FCT00 Overview

Use the download button to access the MBB02070C2003FCT00 schematic symbol, PCB footprint, and 3D model.
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