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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MBB02070C2009FCT00
- Part Number MBB02070C2009FCT00
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
MBB02070C2009FCT00 Details
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Manufacturer Part Number:
MBB02070C2009FCT00
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
AXIAL LEADED
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Reach Compliance Code:
Compliant
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Country Of Origin:
Czechia, India
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.90
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
9
MBB02070C2009FCT00 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for MBB02070C2009FCT00 is a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
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While the MBB02070C2009FCT00 is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments.
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The MBB02070C2009FCT00 is a moisture-sensitive device. To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the devices in a dry, nitrogen-filled environment, and baking them before reflow soldering if they've been exposed to moisture.
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The recommended reflow soldering profile for MBB02070C2009FCT00 is a peak temperature of 260°C, with a ramp-up rate of 3°C/s, a dwell time of 30-60 seconds, and a cool-down rate of 6°C/s.
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While the MBB02070C2009FCT00 is designed to be robust, it's essential to consider the vibration specifications and ensure that the device is properly secured to the PCB to prevent mechanical stress and damage.
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MBB02070C2009FCT00 Overview
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