Description:CECC version (IECQ-CECC approved
according to EN 140101-806)
Excellent overall stability: class 0.25
Wide ohmic range: 0.22 to 22 M
AEC-Q200 qualified available (1)
Radial version available for MBB/SMA 0207
Alternative termination wires available e.g. weldable wire
(MBA/SMA 0204 only)
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
The recommended PCB footprint for MBB02070C7509FCT00 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.3 mm x 0.3 mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined (NSMD) pad for the thermal pad.
To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal interface material (TIM) such as thermal tape or thermal grease. Also, design the PCB with thermal vias to dissipate heat efficiently.
The maximum operating temperature range for MBB02070C7509FCT00 is -55°C to 150°C. However, the device's performance may degrade at temperatures above 125°C, and it's recommended to operate within the specified temperature range for optimal performance.
Yes, MBB02070C7509FCT00 is suitable for high-reliability applications. It's built with a robust design and undergoes rigorous testing to ensure its reliability. However, it's essential to follow proper design and assembly guidelines to ensure the device operates within its specified parameters.
To prevent moisture sensitivity, store MBB02070C7509FCT00 in its original packaging or a dry, nitrogen-filled environment. Avoid exposing the device to humid environments, and handle it with anti-static wrist straps or mats to prevent electrostatic discharge (ESD).
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MBB02070C7509FCT00 Overview
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