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- Stock & Prices $ Price & Stock for MBB0207VD8252BC100
- Part Number MBB0207VD8252BC100
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
MBB0207VD8252BC100 Details
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Manufacturer Part Number:
MBB0207VD8252BC100
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
AXIAL LEADED
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Reach Compliance Code:
Compliant
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Country Of Origin:
Czechia, India
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.90
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Factory Lead Time:
7 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
9
MBB0207VD8252BC100 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the MBB0207VD8252BC100 is a rectangular pad with a size of 2.5 mm x 1.7 mm, with a thermal pad size of 2.2 mm x 1.4 mm. The pad spacing should be 0.5 mm, and the solder mask clearance should be 0.2 mm.
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To ensure proper thermal management, it is recommended to use a thermal pad or a heat sink with a thermal conductivity of at least 1 W/m-K. The device should be mounted on a PCB with a thermal via or a thermal pad to dissipate heat efficiently.
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The maximum operating temperature range for the MBB0207VD8252BC100 is -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range.
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The MBB0207VD8252BC100 is a commercial-grade device and may not meet the requirements for high-reliability or aerospace applications. It is recommended to consult with Vishay Intertechnologies or a qualified reliability engineer to determine the suitability of the device for such applications.
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To ensure proper soldering, it is recommended to use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. The device should be soldered using a reflow soldering process, and the solder joints should be inspected for quality and integrity.
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MBB0207VD8252BC100 Overview
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