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MBRAF260T3G - onsemi

Description: Low Profile Package for Space Constrained Applications; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; 150°C Operating Junction Temperature; Guard-Ring for Stress Protection; These are Pb-Free and Halide-Free Devices Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL 94, V-0; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purpose

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Symbol
MBRAF260T3G - onsemi - PCB symbol
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PCB Footprints
MBRAF260T3G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SMA−FL
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3D Models
MBRAF260T3G - onsemi - 3D model - Small Outline Diode Flat Lead - SMA−FL
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MBRAF260T3G Details

  • Manufacturer Part Number:

    MBRAF260T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA-FL

  • Pin Count:

    2

  • Manufacturer Package Code:

    403AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.07

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    60 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.63 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    60 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRAF260T3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -55°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system.
  • A soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds is recommended. The device should be soldered using a reflow soldering process with a nitrogen atmosphere to prevent oxidation.
  • The device should be stored in a dry, cool place away from direct sunlight. It should be handled with anti-static precautions, such as using an anti-static wrist strap or mat, to prevent damage from electrostatic discharge.
  • The device should be connected to a low-impedance power supply and a stable voltage reference. The input and output pins should be connected to the circuitry with minimal inductance and capacitance to prevent ringing and oscillations.

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MBRAF260T3G Overview

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MBRAF260T3G Alternates

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Part Image NRVBAF260T3G onsemi

Rectifier Diode, Schottky, 1 Phase, 1 Element, 2A, 60V V(RRM), Silicon