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MC100EP11DR2G - onsemi

Description: NECL Mode Operating Range: VCC= 0 V with VEE= -3.0 V to -5.5 V; PECL Mode Operating Range: VCC= 3.0 V to 5.5 V with VEE= 0 V ; Maximum Frequency > 3 GHz Typical; 220 ps Typical Propagation Delay; Open Input Default State; Safety Clamp on Inputs; Q Outputs Will Default LOW with Inputs Open or at VEE

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MC100EP11DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 CASE 751-07 ISSUE AJ-
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MC100EP11DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 CASE 751-07 ISSUE AJ-
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MC100EP11DR2G Details

  • Manufacturer Part Number:

    MC100EP11DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.85

  • Additional Feature:

    NECL MODE: VCC=0 WITH VEE = -3.0V TO -5.5V

  • Family:

    10EP

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.32 ns

  • Propagation Delay (tpd):

    0.3 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.12 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC100EP11DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100EP11DR2G involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the bypass capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To properly bypass the MC100EP11DR2G, use a 0.1uF ceramic capacitor between the VCC pin and the GND pin, and a 10uF electrolytic capacitor between the VCC pin and the GND pin. Place the capacitors as close to the device as possible, and use a low-ESR capacitor for the 10uF capacitor.
  • The maximum operating frequency of the MC100EP11DR2G is 1.5 GHz. However, the actual operating frequency may be limited by the specific application and the quality of the PCB layout.
  • The MC100EP11DR2G has a maximum junction temperature of 150°C. To ensure proper thermal management, use a heat sink or a thermal pad on the exposed pad of the device, and ensure good airflow around the device. It's also recommended to keep the device away from other heat sources on the PCB.
  • The recommended input and output termination for the MC100EP11DR2G is 50 ohms. This can be achieved using a series resistor and a shunt capacitor at the input and output pins.

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