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MC17XS6400DEK - NXP

Description: Power Switch/Driver 1:6 N-Channel 11A 32-HSOP

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Symbol
MC17XS6400DEK - NXP - PCB symbol
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PCB Footprints
MC17XS6400DEK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 32-pin SOIC-EP
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3D Models
MC17XS6400DEK - NXP - 3D model - Small Outline Packages - 32-pin SOIC-EP
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MC17XS6400DEK Details

  • Manufacturer Part Number:

    MC17XS6400DEK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G32

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.45 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    7 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

MC17XS6400DEK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the application note AN12085, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC17XS6400DEK has multiple low-power modes, including Sleep, Doze, and Shutdown. To configure the device for low-power mode, refer to the device's register map and programming guide in the datasheet. Additionally, NXP provides example code and application notes to help with power management.
  • The MC17XS6400DEK has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal vias, and thermal interface materials. NXP provides thermal modeling and simulation tools to help with thermal design.
  • To troubleshoot clock configuration issues, refer to the device's clocking diagram and clock configuration registers in the datasheet. Use a logic analyzer or oscilloscope to verify clock signals and ensure that the clock configuration matches the device's requirements. NXP also provides application notes and FAQs to help with clock configuration and troubleshooting.
  • To ensure EMC and minimize EMI, follow NXP's guidelines for PCB layout, component selection, and shielding. Implement proper filtering, decoupling, and grounding techniques. Additionally, perform EMC testing and certification according to relevant industry standards, such as IEC 61000-4-2 and CISPR 32.

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MC17XS6400DEK Overview

Use the download button to access the MC17XS6400DEK schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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