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MC32PF4210A3ES - NXP

Description: Power Management Specialized - PMIC Power Management IC, i.MX 8M, pre-prog, 10 Bit ADC ,4/6 buck, 7 LDO, 5 boost, QFN 56

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PCB Footprints
MC32PF4210A3ES - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT684-18
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3D Models
MC32PF4210A3ES - NXP  - 3D model - Quad Flat No-Lead - SOT684-18
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MC32PF4210A3ES Details

  • Manufacturer Part Number:

    MC32PF4210A3ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-56

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N56

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.4V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC32PF4210A3ES Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a star topology for power supply connections to minimize noise and EMI.
  • Use a reliable communication protocol like SPI or I2C, and ensure proper signal termination, clock synchronization, and data validation. Also, implement error handling and retries to account for potential communication errors.
  • The maximum power consumption of the PF4210 is around 1.2W. To optimize power consumption, use the lowest possible clock frequency, disable unused peripherals, and use power-saving modes like sleep or standby when not in use.
  • Configure the PF4210 for the desired audio format (e.g., I2S, PCM), set the correct clock frequency, and adjust the gain and attenuation settings according to your specific audio requirements. Also, ensure proper filtering and decoupling of the audio signals.
  • The PF4210 has a maximum junction temperature of 150°C. Ensure good thermal dissipation by using a heat sink, thermal vias, or a thermally conductive PCB material. Also, avoid overheating by keeping the device within the recommended operating temperature range.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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