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MC33078MDREP - Texas Instruments

Description: Enhanced Product Dual High-Speed Low-Noise Operational Amplifier

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MC33078MDREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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MC33078MDREP - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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MC33078MDREP Details

  • Manufacturer Part Number:

    MC33078MDREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.8 µA

  • Bias Current-Max (IIB) @25C:

    0.75 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.15 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    5 V/us

  • Slew Rate-Nom:

    7 V/us

  • Supply Current-Max:

    5 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    16000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

MC33078MDREP Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the MC33078MDREP. Ensure a solid ground plane, keep the input and output capacitors close to the IC, and use a Kelvin connection for the output voltage sense lines. TI provides a recommended layout in the datasheet and application notes.
  • Choose input capacitors with low ESR (Equivalent Series Resistance) and high ripple current rating. For output capacitors, select ones with low ESR, high capacitance, and a voltage rating above the output voltage. TI recommends using X5R or X7R ceramic capacitors or equivalent.
  • The maximum input voltage for the MC33078MDREP is 18V. Exceeding this voltage may damage the IC. Ensure the input voltage is within the recommended range of 7V to 18V for proper operation.
  • The output voltage can be adjusted by changing the resistor divider ratio (R1 and R2) connected to the FB pin. Use the formula provided in the datasheet to calculate the required resistor values for the desired output voltage.
  • The thermal shutdown temperature for the MC33078MDREP is typically around 150°C. If the junction temperature exceeds this value, the IC will shut down to prevent damage.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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