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MC33772BSP1AE - NXP

Description: Battery Management

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PCB Footprints
MC33772BSP1AE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 48-pin LQFP-EP
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3D Models
MC33772BSP1AE - NXP  - 3D model - Quad Flat Packages - 48-pin LQFP-EP
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MC33772BSP1AE Details

  • Manufacturer Part Number:

    MC33772BSP1AE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2018-08-01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Time@Peak Reflow Temperature-Max (s):

    40

MC33772BSP1AE Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33772BSP1AE involves keeping the power traces short and wide, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The inductor value for the MC33772BSP1AE depends on the input voltage, output voltage, and output current. A good starting point is to use the inductor value recommended in the datasheet, and then adjust it based on the specific application requirements.
  • The MC33772BSP1AE is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the thermal design of the system.
  • Proper thermal management for the MC33772BSP1AE involves using a heat sink, ensuring good airflow, and keeping the device away from other heat sources. The thermal pad on the device should be connected to a solid ground plane to help dissipate heat.
  • When using the MC33772BSP1AE, it's essential to use proper EMI filtering to meet regulatory requirements. This includes using a common-mode choke, X-capacitors, and Y-capacitors, and ensuring that the layout is designed to minimize radiation and susceptibility.

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MC33772BSP1AE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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