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MC33887PFK - NXP

Description: Motor / Motion / Ignition Controllers & Drivers 5.0 A H-BRIDGE DRV W/SLP

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MC33887PFK - NXP  - 3D model
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MC33887PFK Details

  • Manufacturer Part Number:

    MC33887PFK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    S-PQCC-N36

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC36,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

MC33887PFK Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33887PFK involves keeping the high-current paths short and wide, using a solid ground plane, and placing the device close to the battery. Additionally, it's recommended to use a shielded inductor and to keep the switching node (SW) away from sensitive analog circuits.
  • To optimize the MC33887PFK for low IQ in low-power modes, ensure that the EN pin is properly biased, disable the internal voltage regulator (VREG) when not needed, and use the lowest possible clock frequency. Additionally, consider using the device's shutdown mode (SD) to reduce IQ to near-zero levels.
  • When selecting an inductor for the MC33887PFK, consider the inductor's saturation current, DC resistance, and core material. Choose an inductor with a high saturation current rating to handle the peak current, low DC resistance to minimize losses, and a core material that can handle the switching frequency (e.g., ferrite or iron powder).
  • To troubleshoot OCP issues, verify that the OCP threshold is properly set, check for any short circuits or excessive load currents, and ensure that the device is properly configured for the application. Also, verify that the OCP pin is not being pulled low externally, and that the device is not overheating.
  • To manage thermal issues with the MC33887PFK, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad. Additionally, consider using a thermal interface material (TIM) to improve heat transfer, and ensure that the device is not exposed to high ambient temperatures.

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MC33887PFK Overview

Use the download button to access the MC33887PFK 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MC338, or try a keyword search, such as Motion Control Electronics

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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