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MC33FS6522NAE - NXP

Description: Power Management Specialized - PMIC System Basis Chip, DCDC 2.2A Vcore LDT, LQFP48EP

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Symbol
MC33FS6522NAE - NXP - PCB symbol
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PCB Footprints
MC33FS6522NAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1571-1
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3D Models
MC33FS6522NAE - NXP - 3D model - Quad Flat Packages - SOT1571-1
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MC33FS6522NAE Details

  • Manufacturer Part Number:

    MC33FS6522NAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN FD/LIN TRANSCEIVER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33FS6522NAE Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12213, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC33FS6522NAE has multiple power modes, including low-power mode, shutdown mode, and standby mode. Configuration is done through the device's registers, and NXP provides a detailed description of the power modes and configuration in the datasheet and application notes.
  • The MC33FS6522NAE has an operating temperature range of -40°C to 125°C. Performance may degrade at higher temperatures, and NXP provides thermal derating guidelines in the datasheet to ensure reliable operation.
  • The MC33FS6522NAE has built-in fault detection mechanisms, such as overcurrent protection and undervoltage lockout. NXP provides guidelines for implementing additional fault detection and protection mechanisms in the application notes and datasheet.
  • NXP provides recommendations for input and output filter components and layout considerations in the application note AN12213 and datasheet to ensure optimal performance and minimize electromagnetic interference (EMI).

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MC33FS6522NAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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