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MC33FS8410G3ES - NXP

Description: Power Management Specialized - PMIC Safety power management IC, QFN56

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Symbol
MC33FS8410G3ES - NXP - PCB symbol
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PCB Footprints
MC33FS8410G3ES - NXP PCB footprint - Other - Other - SOT684-23
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3D Models
MC33FS8410G3ES - NXP - 3D model - Other - SOT684-23
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MC33FS8410G3ES Details

  • Manufacturer Part Number:

    MC33FS8410G3ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    6

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    5.1 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +7.5V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33FS8410G3ES Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12085, which includes guidelines for component placement, routing, and thermal management.
  • Optimization techniques include selecting the correct input and output capacitors, optimizing the inductor selection, and ensuring proper thermal management. NXP provides application notes and design guides to help with optimization.
  • The MC33FS8410G3ES has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias, heat sinks, or thermal interface materials to reduce thermal resistance.
  • Use NXP's troubleshooting guide, which provides a step-by-step approach to identifying and resolving common issues, such as output voltage regulation, efficiency, and thermal performance.
  • Follow NXP's guidelines for EMI and EMC design, including using proper shielding, filtering, and layout techniques to minimize electromagnetic interference and ensure compliance with regulatory standards.

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MC33FS8410G3ES Overview

Use the download button to access the MC33FS8410G3ES schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MC33F, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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