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MC33FS8430G0ES - NXP

Description: Power Management Specialized - PMIC Safety power management IC, QFN56

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Symbol
MC33FS8430G0ES - NXP - PCB symbol
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PCB Footprints
MC33FS8430G0ES - NXP PCB footprint - Other - Other - MC33FS8430G0ES-1
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3D Models
MC33FS8430G0ES - NXP - 3D model - Other - MC33FS8430G0ES-1
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MC33FS8430G0ES Details

  • Manufacturer Part Number:

    MC33FS8430G0ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    6

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    5.1 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +7.5V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33FS8430G0ES Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33FS8430G0ES involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To optimize the performance of the MC33FS8430G0ES in a noisy environment, use a low-pass filter on the input, add a ferrite bead or a common-mode choke to the power supply lines, and use a shielded enclosure to reduce electromagnetic interference (EMI).
  • The MC33FS8430G0ES has an operating temperature range of -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, and the maximum junction temperature should not exceed 150°C.
  • Yes, the MC33FS8430G0ES is suitable for battery-powered devices due to its low quiescent current (IQ) of 1.5 mA. However, the device's power consumption should be considered in the overall power budget of the device.
  • To troubleshoot issues with the MC33FS8430G0ES, check the power supply voltage, ensure proper PCB layout and routing, verify the input voltage and current, and use an oscilloscope to check the output voltage and current waveforms.

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MC33FS8430G0ES Overview

Use the download button to access the MC33FS8430G0ES schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MC33F, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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