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MC33FS8510A2ES - NXP

Description: Power Management IC -0.3V to 60V Automotive 56-Pin HVQFN EP Tray

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MC33FS8510A2ES - NXP PCB footprint - Other - Other - MC33FS8510A2ES-1
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MC33FS8510A2ES - NXP  - 3D model - Other - MC33FS8510A2ES-1
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MC33FS8510A2ES Details

  • Manufacturer Part Number:

    MC33FS8510A2ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    6

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    5.1 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +7.5V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33FS8510A2ES Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the application note AN12085, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC33FS8510A2ES has multiple power modes, including low-power mode, sleep mode, and shutdown mode. Configuration is done through the device's registers. Refer to the device's programming guide and the NXP's application note AN12086 for detailed information on power mode configuration and corresponding power consumption values.
  • The MC33FS8510A2ES has a maximum junction temperature of 150°C. To ensure reliable operation, thermal management is crucial. NXP recommends using thermal vias, thermal pads, and heat sinks to dissipate heat. Additionally, follow the guidelines in the application note AN12087 for thermal design and simulation to ensure reliable operation at high temperatures.
  • The MC33FS8510A2ES has built-in fault detection mechanisms, such as overcurrent protection, overvoltage protection, and thermal shutdown. To implement additional fault detection and protection mechanisms, use external components, such as fuses, TVS diodes, and resistors, and program the device's registers to detect and respond to faults. Refer to the device's datasheet and application notes for more information.
  • The MC33FS8510A2ES is designed to meet EMC standards, such as CISPR 25 and IEC 61967. To ensure compliance, follow the guidelines in the application note AN12088 for PCB layout, component selection, and shielding. Additionally, perform EMC testing and simulation to ensure that the system meets the required standards.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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