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MC33FS8530A0ES - NXP

Description: Power Management IC -0.3V to 60V 56-Pin HVQFN EP Tray -40°C ~ 125°C

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Symbol
MC33FS8530A0ES - NXP - PCB symbol
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PCB Footprints
MC33FS8530A0ES - NXP PCB footprint - Other - Other - SOT684-23_2025-1.1
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3D Models
MC33FS8530A0ES - NXP - 3D model - Other - SOT684-23_2025-1.1
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MC33FS8530A0ES Details

  • Manufacturer Part Number:

    MC33FS8530A0ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    6

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    5.1 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +7.5V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33FS8530A0ES Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12255, which includes guidelines for component placement, routing, and thermal management.
  • Optimization techniques include selecting the correct output capacitor, optimizing the inductor selection, and adjusting the switching frequency. NXP provides application notes and design guides to help with optimization.
  • The device has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. NXP provides thermal management guidelines in the datasheet and application notes.
  • NXP provides EMC guidelines in the application note AN12255, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI).
  • The MC33FS8530A0ES is manufactured according to NXP's quality and reliability standards, which include ISO/TS 16949 and AEC-Q100. The device is also qualified according to the Automotive Electronics Council (AEC) standards.

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MC33FS8530A0ES Overview

Use the download button to access the MC33FS8530A0ES schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MC33F, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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