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MC33HB2000AES - NXP

Description: Bipolar Motor Driver CMOS SPI 28-HVQFN (6x6) 5V ~ 28V 10A -40°C ~ 125°C (TA).

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Symbol
MC33HB2000AES - NXP - PCB symbol
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PCB Footprints
MC33HB2000AES - NXP PCB footprint - Other - Other - SOT788_3(DD)
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3D Models
MC33HB2000AES - NXP - 3D model - Other - SOT788_3(DD)
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MC33HB2000AES Details

  • Manufacturer Part Number:

    MC33HB2000AES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-28

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2020-02-24

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Analog IC - Other Type:

    HALF BRIDGE BRUSH DC MOTOR CONTROLLER

  • JESD-30 Code:

    S-PQCC-N28

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.24SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    20 mA

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    6 mm

MC33HB2000AES Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency signals away from the power planes and use a shielded cable for the USB interface.
  • Use the NXP configuration tool to generate the configuration file and load it into the device. The tool provides a graphical interface to select the desired settings and generates the necessary code.
  • The device has a maximum junction temperature of 125°C. Ensure good airflow around the device and use a heat sink if necessary. The thermal pad on the bottom of the package should be connected to a solid ground plane.
  • Use the NXP debug tool to access the device's registers and monitor its behavior. Check the device's status registers and error flags to identify the source of the issue.
  • The device has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat and ensure the device is properly grounded.

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MC33HB2000AES Overview

Use the download button to access the MC33HB2000AES schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MC33H, or try a keyword search, such as Motion Control Electronics

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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