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MC33HB2000EK - NXP

Description: 10 A H-Bridge, SPI programmable brushed DC motor driver

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MC33HB2000EK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOIC/W
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MC33HB2000EK - NXP  - 3D model - Small Outline Packages - SOIC/W
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MC33HB2000EK Details

  • Manufacturer Part Number:

    MC33HB2000EK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOICW-32

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2016-09-20

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Analog IC - Other Type:

    HALF BRIDGE BRUSH DC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    16 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SOP32,.4,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.45 mm

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

MC33HB2000EK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the MC33HB2000EK evaluation board user manual, which includes guidelines for component placement, routing, and thermal management. Following this layout can help ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC33HB2000EK supports various battery chemistries, including Li-ion, Li-polymer, and Lead-Acid. To configure the device for a specific battery chemistry, you need to adjust the battery profile settings, such as the charge voltage, charge current, and termination voltage, using the device's registers or through the NXP-provided software development kit (SDK).
  • The MC33HB2000EK can handle a maximum charging current of 2A, but this can be limited by the external components, such as the charging FET and the sense resistor. It's essential to ensure that the external components are rated for the desired charging current to prevent overheating or damage.
  • The MC33HB2000EK has a built-in overcharge protection feature that can be enabled through the device's registers. You need to set the overcharge detection voltage and timeout period according to your specific application requirements. Additionally, you can use external components, such as a voltage supervisor, to provide an additional layer of overcharge protection.
  • Yes, the MC33HB2000EK can be used for charging multiple batteries in parallel, but this requires additional external components, such as a balancing circuit, to ensure that each battery is charged equally and safely. You may also need to modify the device's configuration and charging algorithm to accommodate the parallel charging configuration.

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MC33HB2000EK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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