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MC33HB2000EKR2 - NXP

Description: Motor / Motion / Ignition Controllers & Drivers H-Bridge, SPI, Brushed DC Motor Driver, 5-28V, 10A, Cur FB, Sleep, SM-8, SOICW-EP 32

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MC33HB2000EKR2 - NXP - PCB symbol
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PCB Footprints
MC33HB2000EKR2 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOIC/W
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MC33HB2000EKR2 - NXP - 3D model - Small Outline Packages - SOIC/W
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MC33HB2000EKR2 Details

  • Manufacturer Part Number:

    MC33HB2000EKR2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOICW-32

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Analog IC - Other Type:

    HALF BRIDGE BRUSH DC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    16 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SOP32,.4,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.45 mm

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

MC33HB2000EKR2 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12085, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC33HB2000EKR2 has multiple operating modes, including buck, boost, and buck-boost. Configuration is done through the I2C interface, and NXP provides a detailed description of the register settings and commands in the datasheet and application notes.
  • Although the datasheet specifies a maximum input voltage of 18V, NXP recommends limiting the input voltage to 16V to ensure reliable operation and prevent damage to the device.
  • NXP recommends using a thermal pad or heat sink to dissipate heat generated by the device. The application note AN12085 provides guidelines for thermal management, including thermal resistance calculations and heat sink design recommendations.
  • NXP recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for input decoupling. The application note AN12085 provides more information on input capacitor selection and placement.

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MC33HB2000EKR2 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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