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MC33PF8100CFES - NXP

Description: Power Management IC, i.MX8, pre-prog, 7 buck, 4 LDO, Auto, QFN 56

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Symbol
MC33PF8100CFES - NXP - PCB symbol
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PCB Footprints
MC33PF8100CFES - NXP PCB footprint - Other - Other - HVQFN56
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3D Models
MC33PF8100CFES - NXP - 3D model - Other - HVQFN56
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MC33PF8100CFES Details

  • Manufacturer Part Number:

    MC33PF8100CFES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HVQFN-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.6V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33PF8100CFES Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the power traces short and wide, and use a common mode filter to reduce EMI.
  • Use the NXP configuration tool to generate a configuration file that meets your specific requirements. The tool provides a graphical interface to select the desired settings and generates a configuration file that can be loaded into the device.
  • The maximum current that the MC33PF8100CFES can deliver is 1.5A per channel. However, the actual current delivery is dependent on the input voltage, output voltage, and thermal conditions.
  • Use the NXP debug tool to monitor the device's registers and status. Check the device's fault flags and error codes to identify the source of the issue. Also, verify that the device is properly configured and that the input and output voltages are within the recommended range.
  • Yes, the MC33PF8100CFES is designed to work seamlessly with other NXP devices, such as microcontrollers and power management ICs. However, ensure that the devices are properly configured and that the system is designed to meet the specific application requirements.

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MC33PF8100CFES Overview

Use the download button to access the MC33PF8100CFES schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MC33P, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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