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MC33PF8100CHES - NXP

Description: Power Management Specialized - PMIC Power Management IC, i.MX8, pre-prog, 7 buck, 4 LDO, Auto, QFN 56

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Symbol
MC33PF8100CHES - NXP - PCB symbol
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PCB Footprints
MC33PF8100CHES - NXP PCB footprint - Other - Other - SOT684-21 (DD/SC)
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3D Models
MC33PF8100CHES - NXP - 3D model - Other - SOT684-21 (DD/SC)
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MC33PF8100CHES Details

  • Manufacturer Part Number:

    MC33PF8100CHES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HVQFN-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.6V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33PF8100CHES Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the MC33PF8100CHES application note (AN5071). It's essential to follow this layout to minimize noise, ensure proper thermal management, and optimize performance.
  • The MC33PF8100CHES has a programmable output voltage feature. You can configure the output voltage using the I2C interface and the appropriate register settings. Refer to the datasheet and application note for detailed instructions.
  • The MC33PF8100CHES can handle input voltages up to 18V. However, it's recommended to operate within the specified input voltage range (6.5V to 16V) for optimal performance and reliability.
  • The MC33PF8100CHES has built-in OCP and SCP features. You can configure these features using the I2C interface and the appropriate register settings. Refer to the datasheet and application note for detailed instructions.
  • The MC33PF8100CHES has a thermal pad that must be connected to a thermal plane on the PCB to ensure proper heat dissipation. NXP recommends using a thermal interface material (TIM) and a heat sink to maintain a junction temperature below 125°C.

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MC33PF8100CHES Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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