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MC33PF8100EAES - NXP

Description: Power Management IC 2.7V to 5.5V Automotive 56-Pin HVQFN EP Tray

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Symbol
MC33PF8100EAES - NXP - PCB symbol
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PCB Footprints
MC33PF8100EAES - NXP PCB footprint - Other - Other - HVQFN56 (Automotive grade)_1
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3D Models
MC33PF8100EAES - NXP - 3D model - Other - HVQFN56 (Automotive grade)_1
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MC33PF8100EAES Details

  • Manufacturer Part Number:

    MC33PF8100EAES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HVQFN-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.6V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33PF8100EAES Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12255, which includes guidelines for component placement, routing, and thermal management.
  • Optimization techniques include selecting the right input and output capacitors, optimizing the inductor selection, and using the correct layout and routing techniques. NXP provides application notes and design guides to help with optimization.
  • The MC33PF8100EAES has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. NXP provides thermal management guidelines in the datasheet and application notes.
  • NXP provides troubleshooting guides and application notes that cover common issues and their solutions. Engineers can also use oscilloscopes and other diagnostic tools to identify and fix issues.
  • The MC33PF8100EAES is designed to meet EMI and EMC standards, but engineers must still follow best practices for PCB layout, component selection, and shielding to minimize EMI and ensure EMC compliance.

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MC33PF8100EAES Overview

Use the download button to access the MC33PF8100EAES schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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