Please enter a minimum 3 letters or numbers
Technical Content
Part Image

MC33PF8100EPES - NXP

Description: Power Management Specialized - PMIC Power Management IC, i.MX8, pre-prog, 7 buck, 4 LDO, Auto, QFN 56

Download MC33PF8100EPES Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
MC33PF8100EPES - NXP - PCB symbol
click to zoom
PCB Footprints
MC33PF8100EPES - NXP PCB footprint - Other - Other - SOT684-21(DD/SC)_2025-3
click to zoom
3D Models
MC33PF8100EPES - NXP - 3D model - Other - SOT684-21(DD/SC)_2025-3
click to zoom

MC33PF8100EPES Details

  • Manufacturer Part Number:

    MC33PF8100EPES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HVQFN-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.6V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33PF8100EPES Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12247, which includes guidelines for component placement, routing, and thermal management.
  • Optimization techniques include selecting the right input and output capacitors, optimizing the inductor selection, and using the correct layout and routing techniques. NXP provides application notes and design guides to help with optimization.
  • The MC33PF8100EPES has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. NXP provides thermal management guidelines in the datasheet and application notes.
  • NXP provides troubleshooting guides and application notes that cover common issues and their solutions. Engineers can also use oscilloscopes and other diagnostic tools to identify and fix issues.
  • The MC33PF8100EPES is designed to meet EMI and EMC standards, but engineers must still follow proper layout and routing techniques to minimize emissions and susceptibility. NXP provides EMI and EMC guidelines in the datasheet and application notes.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MC33PF8100EPES Overview

Use the download button to access the MC33PF8100EPES schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MC33P, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to MC33PF8100EPES

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑

MC33PF8100EPES Alternates

Showing results

Image Part Number Model
Part Image MC33PF8100EPESR2 NXP Semiconductors

Adjustable, 12 Channel, +2.6V, PQCC56