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MC33PF8101A0ES - NXP

Description: Power Management Specialized - PMIC Power Management IC, i.MX8, non-prog, 5 buck, 3 LDO, Auto, QFN 56

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Symbol
MC33PF8101A0ES - NXP - PCB symbol
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PCB Footprints
MC33PF8101A0ES - NXP PCB footprint - Other - Other - SOT684-21(DDSC)
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3D Models
MC33PF8101A0ES - NXP - 3D model - Other - SOT684-21(DDSC)
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MC33PF8101A0ES Details

  • Manufacturer Part Number:

    MC33PF8101A0ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    9

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33PF8101A0ES Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN5071, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC33PF8101A0ES has a programmable output voltage feature. You can configure the output voltage by connecting the VOUT pin to a resistor divider network, which sets the output voltage based on the resistor values. The datasheet provides a formula to calculate the required resistor values for a specific output voltage.
  • Although the datasheet specifies a maximum input voltage of 5.5V, NXP recommends limiting the input voltage to 5.2V to ensure reliable operation and prevent damage to the device.
  • The MC33PF8101A0ES has built-in OCP and SCP features. To implement these features, you need to connect the OCP pin to a resistor and capacitor network, which sets the overcurrent threshold and response time. The datasheet provides a detailed description of the OCP and SCP circuits.
  • NXP provides a thermal derating curve in the datasheet, which shows the maximum allowed power dissipation versus ambient temperature. You can use this curve to determine the maximum output current and power dissipation at a given temperature.

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MC33PF8101A0ES Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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