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MC33PF8200A0ES - NXP

Description: Power Management Specialized - PMIC Power Management IC, i.MX8, non-prog, 7 buck, 4 LDO, ASIL-B, Auto, QFN 56

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MC33PF8200A0ES - NXP - PCB symbol
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PCB Footprints
MC33PF8200A0ES - NXP PCB footprint - Other - Other - MC33PF8200A0ES-5
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MC33PF8200A0ES - NXP - 3D model - Other - MC33PF8200A0ES-5
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MC33PF8200A0ES Details

  • Manufacturer Part Number:

    MC33PF8200A0ES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HVQFN-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N56

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.6V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33PF8200A0ES Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33PF8200A0ES involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure the MC33PF8200A0ES operates within its thermal limits, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad. Monitor the device's junction temperature (TJ) and adjust the system design accordingly to prevent overheating.
  • When selecting input and output capacitors for the MC33PF8200A0ES, consider the capacitor's equivalent series resistance (ESR), capacitance value, and voltage rating. Choose capacitors with low ESR, high capacitance, and a voltage rating that exceeds the maximum input voltage. X5R or X7R ceramic capacitors are recommended.
  • To troubleshoot issues with the MC33PF8200A0ES, start by verifying the input voltage, output voltage, and current. Check the PCB layout and component placement for any potential issues. Use an oscilloscope to monitor the output voltage and current waveforms. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Operating the MC33PF8200A0ES at a lower input voltage than recommended may result in reduced output voltage, reduced efficiency, and potential instability. Ensure the input voltage meets the recommended minimum to ensure optimal performance and reliability.

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MC33PF8200A0ES Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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