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MC33PF8200DBES - NXP

Description: Power Management IC 2.7V to 5.5V Automotive 56-Pin HVQFN EP Tray

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Symbol
MC33PF8200DBES - NXP - PCB symbol
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PCB Footprints
MC33PF8200DBES - NXP PCB footprint - Other - Other - HVQFN56_2022
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3D Models
MC33PF8200DBES - NXP - 3D model - Other - HVQFN56_2022
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MC33PF8200DBES Details

  • Manufacturer Part Number:

    MC33PF8200DBES

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HVQFN-56

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.6V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC33PF8200DBES Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the power traces short and wide, and use a common mode filter to reduce EMI.
  • Use a thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device temperature using the internal temperature sensor or an external thermistor.
  • Choose capacitors with low ESR, high ripple current rating, and a voltage rating that exceeds the maximum input voltage. Ensure the capacitors are placed close to the device and connected using short, wide traces.
  • Use an oscilloscope to monitor the input and output voltages, and check for signs of overvoltage, undervoltage, or overheating. Verify the PCB layout and component selection meet the recommended guidelines.
  • Yes, but ensure the devices are synchronized using a clock signal, and implement a current sharing mechanism to balance the load. Consult the NXP application note AN12235 for more information.

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MC33PF8200DBES Overview

Use the download button to access the MC33PF8200DBES schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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